SH (ACF) hot pressed silicone skin

Features：This product has good heat resistance, temperature resistance: 300-380℃, thermal conductivity, pressure consistency, compression recovery force, non-adhesiveness, dust resistance, buffer protection and recyclability.

Application：This product is suitable for the ACF hot pressing bonding process (TAB, COG, FOG) of LCD/LCM. It provides uniform pressure and temperature when the flexible circuit board FPC/FFC is hot pressed with the LCD circuit through the anisotropic conductive film ACF, ensuring high-quality hot pressing connection. This product has good heat resistance and can withstand high temperatures of 350°C in a short time (ACF hot pressing). In addition, it can play a role in buffer protection and isolation to prevent static leakage; it can also be used as insulation and heat conduction materials for various semiconductors such as IC, as well as in electric thermistors and temperature sensors.